| abstract |
To provide a structure with a wiring structure that reduces transmission loss while suppressing an increase in plane size of the structure and facilitates formation of a ground conductor surrounding a signal line, and an MEMS relay. A ground conductor 5 includes first ground interconnects 51, 51 which are formed on both width-directional sides of a signal line 13 on the side of one surface of a base substrate 1, second ground interconnects 52, 52 which comprise vias formed in the base substrate 1 and electrically connected to the first ground interconnects 52, 52, a third ground interconnect 53 which electrically connects the second ground interconnects 52, 52 to each other on the side of the other surface of the base substrate 1, and is in parallel with the signal line 13, a fourth ground interconnect 54 formed on the surface side of the cover substrate 3 which is opposed to the base substrate 1, and fifth ground interconnects 55, 55 which comprise through slit interconnects formed on both sides of a cavity part 27 on an intermediate substrate 2 and electrically connect the first ground interconnects 51, 51 and the fourth ground interconnect 54 to each other. |