| abstract |
The present invention provides a highly reliable semiconductor device having enhanced resistance to humidity. An epoxy resin composition of the present invention is used for sealing a semiconductor in the manufacture of semiconductor device, wherein said epoxy resin composition seals a semiconductor element mounted on a lead frame having a die pad or a circuit board, and a metal wire for electrically connecting an electrical joint made on the lead frame or the circuit board and an electrode pad made on the semiconductor element. Said epoxy resin composition contains an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin (A) is assayed by an area method of gel-permeation chromatography, and the resulting area of main peak of said assay is greater than or equal to 90 percent of the total area of peaks. |