| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2011-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ad6f445295c6b6f5aa0a8460677f8c0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca63e2abd709578661e2ec990d29f600 |
| publicationDate |
2012-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201220325-A |
| titleOfInvention |
Conductive paste for offset printing |
| abstract |
The disclosed conductive paste for offset printing is highly suited to offset printing and makes it possible to form high-precision wiring patterns. Said conductive paste contains an organic binder resin, a conductive powder, and an organic solvent that contains 30-90% by mass of a high-boiling-point solvent that has a boiling point of 250-330 DEG C at 760 mmHg. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I620202-B |
| priorityDate |
2010-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |