http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201220006-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_950bce8d103dab1bd282965fde47f9f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate | 2011-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5b57f5ea9b21c8867fe611298f76d3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e4173128b3d7ea60a6777b61e7879b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6895aece2b37a86f1ff992fed360a4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30cf23fd95626dd93e917a5432f2f753 |
| publicationDate | 2012-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201220006-A |
| titleOfInvention | Plasma mediated ashing processes |
| abstract | A plasma ashing process for removing photoresist, polymers and/or residues from a substrate comprises placing the substrate including the photoresist, polymers and/or residues into a reaction chamber; generating a plasma from a gas mixture comprising oxygen gas (O2) and/or an oxygen containing gas; suppressing and/or reducing fast diffusing species in the plasma; and exposing the substrate to the plasma to selectively remove the photoresist, polymers and/or residues from the substrate, wherein the plasma is substantially free from fast diffusing species. |
| priorityDate | 2010-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.