http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201217483-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2010-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f403b77a792bc6cf6b9ac0ea22d539d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce46b129a250186212ed9c83a09c828e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c23dc01d3b821155d21acfb4a6a4619 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3180b6a0c6324ae1b0a02b8e8a740b78 |
| publicationDate | 2012-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201217483-A |
| titleOfInvention | which can prevent an adhesive layer to be wound from rupturing during a step of winding the adhesive layer |
| abstract | The present invention provides an adhesive film and a tape for processing a wafer prepared by using the same, which can prevent an adhesive layer to be wound from rupturing during a step of winding the adhesive layer in the preparation of a tape for processing a wafer precut-processed into a shape corresponding to that of a semiconductor wafer and improve productivity of the precut tape for processing a wafer. Rupture strength per unit of the adhesive layer (12) is greater than or equal to 87.5 times, preferably greater than or equal to 100 times, compared with the peel force per unit of the adhesive layer (12) from the mold release film (11). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I765762-B |
| priorityDate | 2010-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.