abstract |
The present invention provides a production method characterizing by comprising alicyclic epoxy compounds (A), curing agent (B) and curing accelerant (C) which are used as curable components. Comparing to total content of curable components, the content of the alicyclic epoxy compounds (A) is curable epoxy compositions over 60 wt% which cure under the curing conditions of 95 DEG C to 135 DEG C through over 4.5 hours. Based on the production method, to form a curing article having excellent transparency, excellent photo resistance, for example, while using as sealing materials of photo-semiconductor device, excellent crack resistance in thermal cycling test by optimizing temperature and time. |