http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201215268-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_951528804dcdda8541533231723345b0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2010-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5624ffabf5a0f24323779274c38dad24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c3f789916ddaafd0a793dd769122008 |
| publicationDate | 2012-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201215268-A |
| titleOfInvention | Multi-layer flexible printed circuit board structure for protecting inner conductive layer and the manufacturing method thereof |
| abstract | A multi-layer flexible printed circuit board structure for protecting inner conductive layer thereof, which includes: an outer layer of copper foil, an insulating substrate, an anti-overflow film, a soft board and a conductive layer. Outer layer of copper foil, and insulating substrate are bonded together. Anti-overflow film and the insulating substrate are also bonded together. The soft board has a copper foil substrate, a plurality of circuit parts, and a plurality of sticky films. The inner conductive layer is disposed on the circuit part. The anti-overflow film prevents etching liquor infiltrate into the conductive layer of the multi-layer flexible printed circuit board. Therefore, the multi-layered flexible printed circuit board processing is completed, which can easily peel off the insulating substrate for exposing the conductive layer. |
| priorityDate | 2010-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.