| abstract |
The invention provides a kind of photosensitive resin composition, the composition not only obtains highly flatness, sensitivity(photosensitivity), heat-resistance, transparency and low residual film, but also significantly increases the sealing property between panels, preferably, having a minimum loss of over-coating in the developing step of an existing organic insulating film to which the current silsesquioxane composition having epoxy functional groups is introduced, and by introducing silsesquioxane composition having photosensitive functional groups, the crosslinking density of the developing step is enhanced so that the loss of a film coating in said developing step is minimized, the photosensitive resin composition can be applicable to the organic insulating film in different kinds of developing steps. |