http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201213439-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
| filingDate | 2011-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_155082b3cd3aff645a44422bd767f33d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_801cc3aadfc94908298e6439d14db50c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6271aa8c96c86204624da2861e5f556f |
| publicationDate | 2012-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201213439-A |
| titleOfInvention | Polyamide resin composition used in reflector for surface mount LED |
| abstract | The present invention provides a polyamide resin composite which has excellent heat resistance, formability in injection molding, low water absorbency and surface reflectivity is suitable for reflector for surface mount LED. The polyamide resin composite used in reflector for surface mount LED is characterized in that the polyamide resin composite not only contains copolymerized polyamide resin (A), titanium oxide(B), at least one reinforcing material selected from the group consisting of fibrous reinforcing material and needle-shaped reinforcing material (C) and unfibrous or non-needle-shaped filler (D), but also contains 0.5-100 parts by mass of titanium oxide(B), 0-100 parts by mass of reinforcing material (C) and 0-50 parts by mass of unfibrous or non-needle-shaped filler (D) to 100 parts by mass of copolymerized polyamide resin (A), the copolymerized polyamide resin (A) not only has constitutional unit formed from a molar equivalent salt of diamine and terephthalic acid having 2-8 carbon atoms over 50 mol% but also satisfies (a) and (b), and the polyamide resin composite satisfies (c). (a)7.5 ≤ number of carbon atoms in copolymerized polyamide resin/number of amide bonds in copolymerized polyamide resin ≤ 8.2 (b)0.27 ≤ number of carbon atoms on aromatic rings in copolymerized polyamide resin/number of total carbon atoms in copolymerized polyamide resin ≤ 0.35 (c)temperature of DSC melting peak present in the lowest temperature side result in copolymerized polyamide resin (A) of polyamide resin composite is 300-340 DEG C. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I615418-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I770042-B |
| priorityDate | 2010-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 223.