| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-794
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D109-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-728
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-6208 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L47-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D109-00 |
| filingDate |
2011-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5684c61a4af9fd6111997a81d0c2d62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b42b7a60a92a56d2017f72fba80d5858
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c3ae7c36ea870a0acddfe95e805ba4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9678697bd4d3aa618c49245b5a75005a |
| publicationDate |
2012-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201213394-A |
| titleOfInvention |
Modified polyamideimide resin, electrically insulating material, method for improving dielectric breakdown resistance of insulating layer, and insulated wire |
| abstract |
Disclosed is a method for improving the dielectric breakdown resistance of an insulating layer, which is applied for the purpose of improving the dielectric breakdown resistance of an insulating layer that is provided on a conductor. The method for improving the dielectric breakdown resistance of an insulating layer is characterized by forming the insulating layer by coating the conductor with an electrically insulating material, which contains at least one kind of a modified polyamideimide resin that is selected from the group 1 and the group 2 mentioned below, and baking the electrically insulating material thereon. Group 1: modified polyamideimide resins which are obtained by causing a tricarboxylic acid anhydride or a derivative thereof and a diisocyanate compound or a diamino compound to react with each other in the presence of at least one polybutadiene resin or a hydrogenated product thereof Group 2: modified polyamideimide resins which are obtained by mixing at least one polybutadiene resin or a hydrogenated product thereof and a polyamideimide resin |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I671765-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I680998-B |
| priorityDate |
2010-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |