| abstract |
Disclosed is a photosensitive resin composition which is a non-halogen composition thus has a low environmental impact, is fire-resistant thus exhibits less warpage, exhibits excellent bendability, and which can form a coating film which exhibits excellence in characteristics such as solder heat resistance and gold plating resistance. The disclosed photosensitive resin composition is characterised by comprising a photosensitive resin having a structure represented by general formulas (1)-(3), a photopolymerization initiator, and a compound containing phosphorous and/or aluminium hydroxide. |