| abstract |
Disclosed are a method, in the manufacture of a semiconductor device, for washing a wafer (1) whilst preventing pattern collapse in the wafer (1), which includes elemental silicon on at least the surface of concave sections of a convex-concave pattern (2) formed on the surface thereof, and a chemical solution for forming a water-repelling protective film which can be efficiently washed, the chemical solution being used in the washing method. The disclosed chemical solution for forming a water-repellent protective film is for forming a protective film (10) on at least the surface of concave sections in a convex-concave pattern (2) when a wafer (1) is washed, said wafer having a convex-concave pattern (2) on the surface thereof, with at least part of the convex-concave pattern (2) containing elemental silicon, and the chemical solution containing a dialkylsilyl compound represented by general formula (1), and not containing an acid or base. (1) R2 (H) SiX |