| abstract |
This invention intends to provide an epoxy resin composition capable of being used as base material that can maintain nonflammability without containing halogen-based nonflammable agent in the epoxy resin composition, and has a heat-resistant property that can deal with lead-free solder and furthermore, maintains excellent adhesion of plating. The invention also provides prepreg obtained from the above composition, metal-clad laminate and print wiring boards with a resin insulation layer formed from the composition. To this end, we use (A) polymer compounds consisting of phospha- phenanthrenes, and at least one kind of constituent selected from a constitutive unit of phenolic novolac polymer and a constitutive unit of phenolic novolac polymer with its hydrogen atoms of phenolic hydroxyl groups being substituted phosphaphenanthrenes, (B) epoxy resin that includes at least two epoxy groups in one molecule, and (C) hardening agent for hardening the epoxy resin. |