| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2011-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3294e4d9172dc3b50ad291dc55275f65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd16b2f21cad3448fc8ba19e432edd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d17af992ec3d68de42fbd0276b44b42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccad29628c623383b95bb3f326b0b915
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd717ce101354a0150e137584b24d77c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4d4cd6fee771a73b735ddd6f42e79e1 |
| publicationDate |
2012-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201207896-A |
| titleOfInvention |
Method for manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor device |
| abstract |
A method for manufacturing a semiconductor wafer bonding product includes a process of forming a spacer having wall portions 104' by exposing a spacer forming layer by selectively irradiating with exposing light, and then developing the spacer forming layer using a developing solution, wherein when a width of each of the wall portions 104' is defined as W ( μ m) and a height of each of the wall portions 104' is defined as H ( μ m), W and H satisfy the following relations (1) to (3). 15 ≤ W ≤ 3000 (1) 3≤ H ≤ 300 (2) 0.10 ≤ W/H ≤ 900 (3) This makes it possible to prevent or suppress suspended solid matters generated in the developing step from remaining in the semiconductor wafer bonding product as residue when the spacer to be provided between a semiconductor wafer and a transparent substrate is formed by subjecting it to the exposing and developing steps. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I791609-B |
| priorityDate |
2010-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |