http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201204208-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_30c9920fec6e8b6257301b3369611749 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c38c09cb6b53e154f761c287bcd9548e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff7fd9b3decf72f97e2ce828a7508b67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c20dcc55afa15bfae9bc66e3f5d50108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e8aa613d094199de410ab10517f7b0a |
| publicationDate | 2012-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201204208-A |
| titleOfInvention | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
| abstract | Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9795040-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9345149-B2 |
| priorityDate | 2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 167.