| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05672
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3192 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2010-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc649e3bb93b1b075de2ca92f375341b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bea41a9079dd6766abaa9f9e400540d |
| publicationDate |
2012-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201203403-A |
| titleOfInvention |
Semiconductor element and fabrication method thereof |
| abstract |
Proposed is a semiconductor element and fabrication method thereof, comprising forming an encapsulating layer on a semiconductor silicon substrate having electrode pads and a protection layer formed thereon for encapsulating electrode pads and parts of its surrounding protective layer therein; forming a covering layer on the protective layer and the encapsulating layer with an opening exposed from parts of the encapsulating layer; forming a bonding metallic layer on parts of the encapsulating layer that are exposed from the opening and electrically connecting the bonding metallic layer to the encapsulating layer, wherein the diameter size of the metallic layer is smaller than or equal to that of the encapsulating layer; and forming a conductive element on an outer surface of the bonding metallic layer. The encapsulating layer provides a good buffering effect to prevent electrode pads from delamination or being damaged by the direct pressure transferred from the conductive element. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I490994-B |
| priorityDate |
2010-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |