| abstract |
Proposed is a semiconductor package without a chip carrier formed thereon and a fabrication method thereof, characterized by forming a plurality of grooves and corresponding metal bumps by half etching on a metallic carrier; filling a first encapsulant in the grooves and forming electrical connecting pads on the metal bumps and the first encapsulant is bonded with the metal bumps to form a T-shaped structure, which further enhances bonding therebetween and prevents delamination; and subsequently performing die-mounting, wire-bonding and packaging processes. The half-etched grooves filled with the encapsulant can overcome the drawbacks of having pliable coins and thus is difficult for transportation as encountered in prior techniques and also reduce the manufacturing costs by not requiring the use of costly metals as an etching layer. |