| abstract |
An adhesive composition for connecting a first circuit part having a first connecting terminal on main surface and a second circuit part having a second connecting terminal on main surface, and the first circuit part and/or second circuit part include substrates having thermal plastic resin of glass transition temperature of 200 DEG C or less, the first connecting terminal and/or second connecting terminal include ITO and/or IZO, and the adhesive composition includes a compound containing phosphoric acid group, and a concentration of ionize phosphoric acid in a cured object of the adhesive composition is 100 mass ppm or less. |