| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K13-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 |
| filingDate |
2011-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbee9d7ccebcd03a0a407cb412e9465e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_611b16c309adb7714bc3cfbde5c72cb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7053f43f2828c5c661f8d13c449f00c3 |
| publicationDate |
2011-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201144369-A |
| titleOfInvention |
Thermoplastic resin with high thermal conductivity |
| abstract |
Disclosed is a thermoplastic resin which can greatly increase thermal conductive ratio in a resin composition when said composition comprises thermally conductive filler, and which is capable of being injection moulded even in multipurpose injection moulding moulds. The thermoplastic resin is characterised in that a principal chain is mainly formed by repeated specified units, and 60 mol% or more of molecular chain ends are a carboxyl group. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I471372-B |
| priorityDate |
2010-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |