| abstract |
Disclosed are: a photocurable resin composition which can be developed with an alkali, has excellent resolution properties, and enables the production of a cured article having excellent (wet) heat resistance and thermal impact resistance; a dry film; a cured product of the composition; and a printed wiring board produced using the cured product. The photocurable resin composition is characterized by comprising a resin containing a carboxyl group, a photopolymerization initiator, and surface-treated neuburg siliceous earth particles. |