abstract |
Provided is a thermosetting composition which exhibits low warpage and excellent long-term electrical insulation reliability, and which can form an insulating film that prevents the wirings on a flexible wiring board from disconnecting. Specifically, disclosed is a thermosetting composition for forming an insulating film, by curing said thermosetting composition, on a flexible wiring board which is formed by creating a wiring pattern on a flexible substrate, wherein the cured product obtained by curing said composition has a tensile elastic modulus of 0.5 to 2.0GPa. |