| abstract |
Provided is a resin composition which can yield, with the inorganic filler content kept at a level approximately equivalent to that of conventional resins, a cured product that exhibits a low thermal expansion coefficient in the plane direction and that has excellent heat resistance and flame retardance. A resin composition which comprises (A) an epoxy resin, (B) a maleimide compound, (C) a curing agent, and (D) an inorganic filler, wherein the epoxy resin (A) is a compound represented by general formula (I). |