http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201139741-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6038f17109882ad88e9ba8ea907ebb45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate | 2011-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87ad199011ff7630b2415ab4a08b768d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_725b00f257c2761e9cd849016367c53f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28f4fc76f9d53245ae1aa9f5cd47dd43 |
| publicationDate | 2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201139741-A |
| titleOfInvention | Etching solution for copper and substrate manufacturing method |
| abstract | An object of the present invention is to provide an etching solution, which enhances removability of a seed layer in a substrate manufacturing process, and at the same time is less likely to cause undercut when the seed layer is removed, and a method for manufacturing a substrate using the etching solution. There is provided a copper etching solution containing sulfuric acid and hydrogen peroxide, which is characterized by that the etching solution comprises benzotriazole compounds having nitro substituents and organic amine compounds. Also, provided is a method of manufacturing a substrate using the etching solution. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I622665-B |
| priorityDate | 2010-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.