http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201139597-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_baa28358db9ee57960a64c07cbc1ff35 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3468 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-1496 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-1222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-4845 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-1435 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-1224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-1467 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-1483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-1406 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-1226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S228-901 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-183 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F16B11-006 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M50-204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M50-183 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00 |
| filingDate | 2011-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e18b3832ff67dc9a76741550d5117f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09ca20f8d865b5998b4c540b90859ac6 |
| publicationDate | 2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201139597-A |
| titleOfInvention | Selective cure of adhesive in modular assemblies |
| abstract | Methods and systems for decreasing costs (expense, mass, and/or cure time) associated with use of adhesives when assembling modularized components, particularly for assemblies having many elements such as for example battery modules used in electric vehicles. The methods and systems enable use of high-wettability adhesives (defined generally in this application as low viscosity and/or low surface tension adhesives) for assembling such modularized components. A first method including (a) dispensing a high-wettability adhesive into a first module fixture populated with a plurality of elements wherein the first module fixture provides a plurality of bonding wells with each bonding well accepting a first portion of one or more of the elements with the module fixture including one more apertures communicated with one or more of the bonding wells, the adhesive being selectively curable upon application of a curing modality; (b) applying the curing modality selectively to a first portion of the dispensed adhesive in a seal zone, the seal zone including one or more regions surrounding the apertures wherein the dispensed adhesive in the seal zone is sufficiently cured to inhibit significant quantities of the adhesive from emerging from the apertures while the adhesive continues to be dispensed into the module fixture wherein the curing modality is not applied to a second portion of the adhesive outside of the seal zone; and (c) applying the curing modality to the second portion of the dispensed adhesive. |
| priorityDate | 2010-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.