http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201139536-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b58ecfdcd01b5bd3e5014a4c5c90f2e1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2003-1068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2483-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3412 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5403 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 |
| filingDate | 2011-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da024dbd5d0e95a89ad3034a87cd6f7c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cba1d9c3664805f4db463682a540a3b7 |
| publicationDate | 2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201139536-A |
| titleOfInvention | Curable resin composition |
| abstract | Disclosed is a curable resin composition which can be reduced in the burden on the environment, while securing safety and having extremely high curability at low temperatures. Specifically disclosed is a curable resin composition which contains: a curable resin (A) that has a crosslinkable silicon group in each molecule, said crosslinkable silicon group having a chemical structure wherein a carbon atom is bonded to a silicon atom in the crosslinkable silicon group and a heteroatom having an unshared electron pair is bonded to the carbon atom; a curable resin (B) that has a crosslinkable silicon group in each molecule and a main chain composed of a vinyl polymer, said crosslinkable silicon group having a structure wherein an alkylene group having two or more carbon atoms is bonded to a silicon atom; and a basic compound (C). The curable resin composition is characterized in that the (mass) ratio of the curable resin (A) to the curable resin (B) is from 5:95 to 95:5, and the basic compound (C) is contained in an amount of 0.1-30 parts by mass relative to 100 parts by mass of the total of the curable resin (A) and the curable resin (B). |
| priorityDate | 2010-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 274.