| abstract |
The object of this invention is to provide an epoxy resin composition for sealing optical semiconductor devices, which can maintain heat resistance, light resistance, and crack resistance, and is excellent in gas permeability resistance and film curing property. A composition includes: (A) a silicone modified epoxy compound having specific structure, (B) a curing agent, based on one equivalent of epoxy group in component (A), (B) is 0.5 to 1.5 equivalent, (C) a polyol, based on one equivalent of curing agent (B), (C) is 0.01 to 1.0 equivalent. |