| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2054 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-062 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2010-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10749eb7794cf7dd485568d013a186ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2bba02c3f9b0046f8fcebd4540ee45a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36d3c0c55e4aa83c4ed7db29966af3e2 |
| publicationDate |
2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201139469-A |
| titleOfInvention |
Curable resin composition and printed wiring board using the same |
| abstract |
Disclosed is a curable resin composition which enables the production of a solder resist film that does not undergo the deterioration in reflectance caused by the passage of time or thermal history and has flexibility and low warpage properties. The curable resin composition is characterized by comprising: (A-1) a copolymer resin that is produced by the reaction of a compound represented by general formula (I) with a compound represented by general formula (II) and/or a compound represented by general formula (III), or (A-2) a copolymer resin that is produced by adding a compound having an oxirane ring and an ethylenically unsaturated bond to one or some of carboxyl groups in a copolymer produced by the reaction of a compound represented by general formula (I) with a compound represented by general formula (II) and/or a compound represented by general formula (III); (B) a curing agent; and (C) a diluent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104516203-A |
| priorityDate |
2009-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |