http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201138046-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate | 2010-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f760b65fe28aaeee87904e2780c8f15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6a7c943f9d5077692af68ff9b10e49b |
| publicationDate | 2011-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201138046-A |
| titleOfInvention | Semiconductor package having multi-sided die base and method for forming the same |
| abstract | A semiconductor package having a multi-sided die base is proposed, comprising a multi-sided die base having at least five sides; a plurality of electrical conductive pins disposed at the periphery of the multi-sided die base with a predetermined distance from the sides; a die disposed on the multi-sided die base and electrically connecting with the conductive pins via a solder wire; and an encapsulant for encapsulating the multi-sided die base, the conductive pins and the die, thereby shortening the distance between the conductive pins and the die which not only reduces the cost of solder wires but also the occurrence of wire sweep. The invention further provides a method for fabricating a semiconductor package capable of reducing the length of solder wires and a leadframe structure. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I767822-B |
| priorityDate | 2010-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.