http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201136333-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R23-00 |
| filingDate | 2010-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c275fdf234cdd9957286d499d8e8f1db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1ed4069390d1179feaca76aa78b2b09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18ef2c949c795e75d0a86dd50a40c761 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7b254c4247ace880eebd05aff856153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69dd66270539223ce6760ce1a985e027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e07905e968a27e62c729db28ad137b1e |
| publicationDate | 2011-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201136333-A |
| titleOfInvention | Wafer level package of MEMS microphone and manufacturing method thereof |
| abstract | A wafer level package of micro electromechanical system (MEMS) microphone includes a substrate, dielectric layers, a MEMS diaphragm, supporting rings and a protective layer. The dielectric layers are stacked on the substrate. The MEMS diaphragm is disposed between two adjacent dielectric layers and there is a first chamber between the MEMS diaphragm and the substrate. The supporting rings are respectively disposed in some dielectric layers and are stacked with each other. An inner diameter of the lower supporting ring is greater than that of the higher supporting ring, and the highest supporting ring is located in the highest dielectric layer. The protective layer is disposed on the highest supporting ring and covers the MEMS diaphragm. There is a second chamber between the MEMS diaphragm and the protective layer, and the protective layer has first through holes. The wafer level package of MEMS microphone has an advantage of low cost. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023045827-A1 |
| priorityDate | 2010-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.