| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_758994071efb42b565fc2c04637be131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c41de11cb6a2e56b2c25ffa3c8d94dee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cebc9740ef706cde29e885504f274ffa |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate |
2011-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd34024487f246ccd91610ac0923af65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7bc4ae1766ce4f365cf11f046b2ad78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e625e90ff17c67457673c49945e2afc4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72baf03e4606fd9d144135f234755240 |
| publicationDate |
2011-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201135757-A |
| titleOfInvention |
Conductive film and method for manufacturing same |
| abstract |
A fabricating method having simplicity for making a large area of conductive films having excellent transparency and conductivity is provided. The fabricating method of conductive films includes: disposing a die (B) having opening parts of mesh structures penetrating a surface contacting a substrate (A) and a back surface thereof on the surface of the substrate (A); dispersing and drying a dispersion (D) of conductive particles (P) on the surface of the substrate (A) disposed with the die (B) so that a mesh structure (C) formedwith the conductive particles (P) is formed near the connecting parts of the substrate (A) and the die (B) and then removing the die (B) from the substrate (A) so that the mesh structure (C) formed with the conductive particles (P) is formed on the surface of the substrate (A). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I622668-B |
| priorityDate |
2010-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |