| abstract |
The purpose of this invention is to provide a metal resin complex, which has a layer of heat-resistant resin composition with a low permittivity or dissipation factor and a low thermal expansion coefficient, and can reduce transmission loss of electrical signal. The metal resin complex includes a metal and a resin layer (I) connecting the metal either directly or through an intermediate layer. The resin layer (I) is obtained from a resin composition obtained by mixing a heat-resistant resin (A) with relative permittivity of 2.3 or more at 1 MHz frequency and polyolefin particles (B) with an average particle diameter of 100 μ m or less. The resin composition has a continuous phase of the heat-resistant resin (A), and a dispersed phase obtained from the polyolefin particles (B). The relative permittivity of the resin composition is lower than that of the heat-resistant resin (A). |