http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201134035-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-32341
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-0202
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-02
filingDate 2010-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f6e5124f6d8683e72ae180790dc7a6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7b50d106f43e3ccc753770dd5dde237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_480af8f93464c297112585d69afda41f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5de47ebc353ee4772f7314a986c3011c
publicationDate 2011-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201134035-A
titleOfInvention Method for manufacturing semiconductor device
abstract A method for manufacturing a semiconductor device comprises: forming a semiconductor laminate structure on a substrate so as to form a wafer including a plurality of semiconductor lasers; forming a first groove between the semiconductor lasers on a major surface of the wafer; separating the wafer to laser bars wherein the semiconductor lasers are arrayed in bar shape after forming the first groove; forming a second groove in the first groove of the laser bars, a width of the second groove being identical to or narrower than a width of the first groove; and separating the laser bar into respective semiconductor lasers along the second groove.
priorityDate 2010-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069

Total number of triples: 17.