| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54 |
| filingDate |
2010-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b6b33365e10c85c49ffde5478491ae9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd7e94f66d2edcdaa0e88972acfab215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9194bdfff63eae6e51b341039bdc98d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_530f2d4782c83a30baf5c9b852cb7913 |
| publicationDate |
2011-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201132798-A |
| titleOfInvention |
Method for electroless plating of tin and tin alloys |
| abstract |
The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of ≥ 1 μ m as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers. |
| priorityDate |
2009-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |