http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201131818-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed76131ddda07950fa9ba87fba15eeb6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate | 2010-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_375b92a36f46e9957088b2e2358a8de2 |
| publicationDate | 2011-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201131818-A |
| titleOfInvention | Compound semiconductor package and method for manufacturing thereof |
| abstract | The present invention discloses a package structure of compound semiconductor including a base, a reflector mounted on a top surface of the base and forming a room, at least a semiconductor chip deposed in the room, at least a leadframe deposed between the top surface of the base and the reflector and extending to a bottom surface of the base, an encapsulation gel filled in the room and covering the at least a semiconductor chip, wherein the four lateral sides of the base taper downwardly so that the base has a configuration like an inverted truncated pyramid. Moreover, the present invention also provides a method for manufacturing the package structure. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I556476-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9238317-B2 |
| priorityDate | 2010-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.