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publicationDate 2011-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201131651-A
titleOfInvention Low dielectric constant insulating film
abstract To provide a low dielectric constant insulating film with low dielectric constant, high strength and high plasma damage resistance. The low dielectric constant insulating film includes a polymer including a plurality of straight chain molecules 2, 3, and 4 in which a plurality of basic molecules 1 including SiO structures are coupled in a straight chain and which are coupled by providing binder molecules 5 including the SiO structures in between and includes Si atoms, O atoms, C atoms and H atoms. When the total of three types of signal areas of a signal showing a linear SiO structure, a signal showing a network SiO structure and a signal showing a cage SiO structure among peak signals of a spectrum obtained by Fourier transform infrared spectroscopy is set to be 100%, an area ratio of the signal showing the linear SiO structure is ≥ 49%. When the total of a signal amount showing Si(CH<SB>3</SB>) and that showing Si(CH<SB>3</SB>)<SB>2</SB>is set to be 100% among the peak signals of the spectrum, the signal amount showing Si(CH<SB>3</SB>)<SB>2</SB>is ≥ 66%.
priorityDate 2009-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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