| abstract |
To simultaneously solve the problems of reduction in bonding strength, whitening and coloring of hardening composition, and of corrosion of wires laid on a circuit board which occur, when the acrylic resin is mixed to a bonding agent composition containing alicyclic epoxy compound and acid anhydride for flip-chip mounting of a chip component. The bonding agent composition for flip-chip mounting of a chip component to a circuit board contains: alicyclic epoxy compound; alicyclic acid anhydride system hardening agent; and acrylic resin. The content of alicyclic acid anhydride system hardening agent is 80 to 120 pts.mass for the alicyclic epoxy compound of 100 pts.mass, while the amount of acrylic resin is 5 to 50 pts.mass within 100 pts.mass in total of alicyclic epoxy compound, alicyclic acid anhydride system hardening agent and acrylic resin. The acrylic resin is obtained by co-polymerization of alkyl(metha)acrylate and glycidylmethacrylate of 2 to 100 pts.mass for the alkyl(metha)acrylate of 100 pts.mass, and has a suction coefficient of 1.2% or less. |