| abstract |
To provide a photocurable resin composition having high sensitivity and capable of providing excellent feeling of dryness of a dried coating when a worker touches it with fingers, preventing the generation of outgas during setting, achieving excellent positioning precision, high productivity, and high reliability when forming, for example, solder resist of a printed wiring board. The photocurable resin composition contains photopolymerization initiator having two oxime ester groups in a molecule, a resin containing carboxyl group, and a compound having two ethylene unsaturated groups or more in a molecule. |