http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201126662-A

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filingDate 2010-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_093d6a077395faeceaa09d577ae03b02
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publicationDate 2011-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201126662-A
titleOfInvention Circuit board forming diffusion bonded wall of vapor chamber
abstract A method for providing a high in-plane and through-plane thermal conductivity path between a heat producing electronic device and a heat sink is described. A vapor chamber is formed of a bottom metal shell and a top plate which are diffusion bonded together at their edges. The top plate is itself a circuit board that may be a metal core type, a ceramic type, or any bondable composite material. The metal core circuit board is preferably aluminum, and the dielectric regions on its top surface are aluminum oxide regions. A metal circuit layer is formed on the dielectric regions for interconnecting electronic devices mounted on the circuit board. Since the back surface of the circuit board is directly in contact with the working fluid in the vapor chamber, there is the ultimate in thermal coupling between the circuit board and a heat sink connected to the back of the vapor chamber.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102956576-B
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