| abstract |
Provided are a thermosetting die bonding film and a dicing/die bonding film, in which curing shrinkage after die bonding is inhibited and thereby an object to be adhered is prevented from warpage. The thermosetting die bonding film is utilized for sticking and fixing a semiconductor device to the object to be adhered. The thermosetting die bonding film at least contains epoxy resin and phenol resin as a thermosetting ingredient. The ratio of mole number of the epoxy group to that of the phenolic hydroxyl group in the thermosetting ingredient ranges between 1.5 and 6. |