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publicationDate 2011-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201125673-A
titleOfInvention Reflow sn plated member
abstract Disclosed is a reflow Sn plated member wherein the occurrence of whiskers is suppressed, and which has reduced insertion/removal force. A reflow Sn layer is formed on the surface of base material comprising Cu or a Cu-based alloy, and the orientation index of the (101) plane of the surface of said reflow Sn layer is at least 2.0 and no more than 5.0.
priorityDate 2009-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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