| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33dafb5bbc2ec47ebcb7becbbe60f704 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2010-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d69d4bb1ef41516c78d965f909c850d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eff941ddc8883bac0bc1266ef5ddf334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92e702628ae68c9c633c975ed98e5aa6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6ffc0c870d6f86a0bfc04a26b8127e0 |
| publicationDate |
2011-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201124515-A |
| titleOfInvention |
Slurry for chemical mechanical polishing and method for polishing substrate using the same |
| abstract |
Provided is a slurry for chemical mechanical polishing containing a water-soluble clathrate compound (a), a high-polymer compound (b) having an acid group which may be in the state of salt as side chain, polishing grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001% by mass to 3% by mass with respect to the total amount of the slurry, the high-polymer compound (b) has an average molecular weight equal to or larger than 1000 and equal to or less than 1000000, and the content of the high-polymer compound (b) is 0.12% by mass to 3% by mass with respect to the total amount of the slurry. Also provided is a method for polishing substrate using the slurry. |
| priorityDate |
2009-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |