| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2010-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e63d8344f3180bf354de012373aa4ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0725be6460f83154ffb1894902e3aea9 |
| publicationDate |
2011-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201124264-A |
| titleOfInvention |
Copper clad laminate |
| abstract |
To provide a copper clad laminate having a copper layer formed with high adhesive strength for an insulating layer although surface roughness of the insulating layer is extremely small. The copper clad laminate is manufactured through the processes of: arranging one or more prepregs between two copper foils each having a copper alloy plating layer formed on a surface by electroplating with copper alloy plating layers on prepreg sides, and bonding the copper foils to the prepregs by thermocompression by heating and pressing them under reduced pressure; removing the copper foils with a copper etchant; and forming copper layers on prepreg surfaces by electroless plating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I601457-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I666268-B |
| priorityDate |
2009-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |