http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201122163-A

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filingDate 2010-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9443ad6d09cd08379d89978bdcc5ff7e
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publicationDate 2011-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201122163-A
titleOfInvention Electrolyte and method for the electroplating of copper on a barrier layer, and semiconductor substrate obtained with said method
abstract The invention relates to an electrolyte for copper electroplating on a copper diffusion barrier layer (B), the barrier layer (B) covering a surface of a semiconductor substrate (S), said electrolyte comprising: a source of copper ions; a solvent; wherein the electrolyte has a neutral or basic pH and comprises a suppressor (10) adapted to adsorb directly on the barrier layer (B) so as to at least partially mask the surface of the barrier layer (B). The invention also relates to a method for the electroplating of copper on a barrier layer using said electrolyte, and a semiconductor substrate comprising a copper layer formed using said method.
priorityDate 2009-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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