| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2eacfed524f9e00d6874055c4aa39fcb |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 |
| filingDate |
2009-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92fb13eb2ec419c70b9441091618f6ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d346a7da7bafb1ade2c26fb2d1f4583
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91bfe6a4951e3150f4d69741b100d603 |
| publicationDate |
2011-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201122057-A |
| titleOfInvention |
Electronic material composition. |
| abstract |
A halogen free electronic material composition having features of low dielectric constant and small dissipation factor, containing (a) styrene-maleic anhydride copolymer; (b) polybenzoxazine; (c) a flame retardant; and (d) an additive. The electronic material composition can be taken as a material applied in a HF copper clad laminate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I422610-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8912293-B2 |
| priorityDate |
2009-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |