http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201120256-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2973a1bdaf87d5184fb1e81ebe5d061 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-0079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-0079 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-26 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2010-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_029da82d0375c1d1786b396ed165de83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1092bc41464b6ce88c49def33951a83f |
| publicationDate | 2011-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201120256-A |
| titleOfInvention | Plated resin molding, process for production of plated resin molding, and molded circuit board |
| abstract | Provided is a technique by which a molding of a liquid -crystalline resin composition can be plated without etching, and in which the liquid-crystalline resin composition that constitutes the molding to be plated is not restricted, but may be selected from various compositions. Specifically provided is a process for producing a plated resin molding comprising both a molding of a liquid-crystalline resin composition and a plating film provided on the surface of the molding, said process comprising: using a molding of a liquid -crystalline resin composition wherein substantially no surface layer is present on the skin layer; and forming a plating film on the surface of the molding by a plating method of forcing raw material particles for a plating film to hit the surface of the molding and adhere thereto. The plating method includes ion plating, sputtering, and so on. |
| priorityDate | 2009-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.