abstract |
An adhesive composition is provided. The adhesive composition for adhering semiconductor chip includes a radiation polymerizable compound, a photoinitiator and a thermosetting resin. When the adhesive layer is at B-stage by irradiating light, the adhesion force of adhesive layer is equal to and less than 200 gf/cm<SP>2</SP> at 30 DEG C, and is equal to and larger than 200 gf/cm<SP>2</SP> at 120 DEG C. |