| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2010-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53f7ea23cf4b332661286ec8817747d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc4fe668f21f41e87d9d8348ed16519c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59224293f0057bb4dbfd15a239762891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa8b5adbe152f65fc57a8a14cb31895f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53e5bd6ca1127fce02416e77602593ea |
| publicationDate |
2011-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201118505-A |
| titleOfInvention |
Upper layer film forming composition and method for forming photoresist pattern |
| abstract |
Disclosed is an upper layer film forming composition which is used for the purpose of forming an upper layer film on a photoresist film so as to cover the photoresist film. The upper layer film forming composition contains (A) a resin that is soluble in a developer solution and (B) a solvent component that contains 1-15% by mass of (B1) a solvent that has a boiling point of 180-280 DEG C at 101.3 kPa and a vapor pressure of 0.001-0.1 kPa at 20 DEG C. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103087606-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103087606-B |
| priorityDate |
2009-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |