http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201117960-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20caa64b571ec98459ceca26e3dd4ecf |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 |
| filingDate | 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c560b06797b201c373806f3d1cb12ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef93f0235aeb950759cf5b0f4f6570f5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_660b39826b2c2838f3ce0cec3bc53d9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f375958b1c8161fd30b1d79b7202f765 |
| publicationDate | 2011-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201117960-A |
| titleOfInvention | Multi-layered laminated board with spherical fillers and electronic circuit thereof |
| abstract | A multi-layered laminated board with spherical fillers, more particularly a multi-layered circuit board formed by laminating multiple laminated boards, is disclosed. The multi-layered laminated board is formed by a plurality of conductive layers and insulation layers which are stacked and laminated. Between the conductive layers of the multi-layered laminated board and another adjacent conductive layer, the conductive post of a buried hole structure (also known as a blind hole) is used to increase circuit design versatility. The insulation layers of the multi-layered laminated board contain spherical fillers used to increase the thermal conductivity of the insulation layers and modulate the thermal expansion property thereof. The insulation layers are generally made by prepregs which are thermally bonded by a thermal platen and cured. In a high temperature and high pressure bonding process of a thermal plate, the prepregs are melted into resin solution and filled into the buried hole structure mentioned above. The spherical fillers in the prepregs can flow easily in the buried hole and uniformly distributed therein. The resin solution is further cured to form the insulation layers. The spherical fillers are uniformly distributed in the buried hole structure of the multi-layered laminated board, thereby effectively improving the overall thermal conductivity of the multi-layered laminated board and modulating the thermal expansion property. The thermal expansion property can dissipate heat efficiently during the downstream high temperature assembly process of the circuit board. The via hole structure of the thermal expansion property will not cause poor heat dissipation and result in sheet cracking, and the thermal tolerance and process yield of the board can be increased. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I569287-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I627055-B |
| priorityDate | 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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