| abstract |
To provide a technique of packaging a sensor structure unit 300 having a touch-sensing surface and a signal processing LSI unit 420 that processes a sensor signal from the sensor structure unit 300. The sensor structure unit 300 includes a touch-sensing surface and sensor electrodes 320 and 330. The signal processing integrated circuit 420 is built into a semiconductor substrate 400. The sensor structure unit 300 and the semiconductor substrate 400 are bonded by an adhesive layer 500, and the sensor device 200 is thereby constructed as one chip. The sensor electrodes 320 and 330 and the integrated circuit 420 are sealed inside the sensor device 200, and external terminals of the sensor electrodes 320 and 330 and the integrated circuit 420 are wired out to the rear surface of the semiconductor substrate 400 through the side of the semiconductor substrate 400. |