| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20 |
| filingDate |
2010-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6617fd0c156d02a9ec3ea81cc60f2fef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_708b48ab2b03dd61b3e659312632b3b6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41c6c6cc81f43bc41f7b564f214ecf99 |
| publicationDate |
2011-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201112273-A |
| titleOfInvention |
Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member |
| abstract |
Disclosed is a circuit connecting material which is provided between circuit electrodes facing each other, applies pressure to the facing circuit electrodes and electrically connects the electrodes in the pressurizing direction. The circuit connecting material contains anisotropic conductive particles having conductive fine particles dispersed in an organic insulating material. |
| priorityDate |
2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |